Seventh IEEE International Workshop on
Testing Three-Dimensional Stacked Integrated Circuits
3D-Test
in conjunction with ITC / Test Week 2016
November 17-18, 2016 - Convention Center Fort Worth, TX, USA
News
Extension of the paper subimmision deadline!
The paper and table-top demos submission deadline has been extended. The new deadline is September 17, 2014.

Please submit your paper here: http://welcome.molesystems.com/tttc/3DTEST/2014

If you are interested in presenting a Table-Top Demo, please contact the workshop's Program Chair Erik Jan Marinissen <erik.jan.marinissen@imec.be>.
Website hosted by Tallinn University of Technology