First IEEE International Workshop on
Testing Three-Dimensional Stacked Integrated Circuits
3D-Test
in conjunction with ITC / Test Week 2010
November 4-5, 2010 - Convention Center - Austin, Texas, USA
Submission
  • Paper submission: September 3, 2010 (closed)
  • Poster submission: October 15, 2010 (closed)

Submissions must be sent in as PDF file via the Welcome paper submission system. The Workshop prefers Full Paper submissions (of up to six pages), but also allows (Extended) Abstract submissions. Detailed submission instructions can be found at the Workshop's website: http://3dtest.tttc-events.org. All submissions will be evaluated for selection with respect to their suitability for the workshop. Selected submissions can at this point only be accepted for poster presentation at the Workshop.

Click here to download the PDF version of the Call for Papers

Submission page: http://www.molesystems.com/welcome/tttc/3dtest/2010/

 

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