Second IEEE International Workshop on
Testing Three-Dimensional Stacked Integrated Circuits
3D-Test
in conjunction with ITC / Test Week 2011
September 22-23, 2011 - Disneyland Hotel Anaheim, California, USA
Submission

Submission of papers in closed now. However, it is still possible to submit proposals for poster presentation. The Workshop prefers Full Paper submissions (of up to six pages), but also allows (Extended) Abstract submissions. All submissions will be evaluated for selection with respect to their suitability for the workshop. Selected submissions can at this point only be accepted for poster presentation at the Workshop.

Key Dates

  • Submission deadline : September 2, 2011
  • Notification of acceptance : September 3, 2011
  • Camera-ready material : September 5, 2011

Submissions must be sent in as PDF file via the Welcome paper submission system.

Click here to download the PDF version of the Call for Posters

Submission page: http://www.molesystems.com/welcome/tttc/3DTEST/2011

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