Fourth IEEE International Workshop on
Testing Three-Dimensional Stacked Integrated Circuits
3D-Test
in conjunction with ITC / Test Week 2013
September 12-13, 2013 - Disneyland Hotel Anaheim, California, USA
Submission

Submissions must be sent in as PDF file via the Welcome paper submission system: http://welcome.molesystems.com/tttc/3DTEST/2013

Key Dates

  • Submission deadline: July 12, 2013
  • Notification of acceptance : August 1, 2013
  • Camera-ready material : August 16, 2013
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