The 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package (PoP), and especially 3D-SICs based on Through-Silicon Vias (TSVs), micro-bumps, and/or interposers. While 3D-SICs offer many attractive advantages with respect to heterogeneous integration, smaller form-factor, higher bandwidth and performance, and lower power dissipation, there are many open issues with respect to testing such products. The 3D-TEST Workshop offers a forum to present and discuss these challenges and (emerging) solutions among researchers and practitioners alike.
3D-TEST will take place in conjunction with the IEEE International Test Conference (ITC) and is sponsored by the Test Technology Technical Council (TTTC) of IEEE Computer Society.
Yervant Zorian - General Chair
700 East Middlefield Road
Mountain View, CA 94043-4033, USA
Tel.: +1 (650) 584-7120
Erik Jan Marinissen - Program Chair
B-3001 Leuven, Belgium
Tel.: +32 (0)16 28-8755
Shi-Yu Huang - Program Vice-Chair:
National Tsing-Hua University
101, Sec. 2, Kuang-Fu Road
Tel.: +886 3-573-1147